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Smart Terminal
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
IC Substrate Materials
IMS and HTC materials
Special Materials
HSD Materials
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
Input specification value filtering
Product List
- product name
- Product brief description
- CTI
- Thermal conductivity（W/m·K）
- Df/10GHz
- Dk/10GHz
- application area
- Dk
- Df
- CTE
- Tg
- Td
- SF230
- Use for high speed circuit FCCL
- --
- --
- 0.005
- 3.2
- 5G
- --
- --
- --
- --
- --
- SF305
- Halogen-free flame-resistant type PI film based flexible copper clad laminate
- --
- --
- 0.028
- 3.6
- Power battery protection board Antenna Module Cable? Vehicle-mounted Module
- --
- --
- --
- --
- --
- SF701
- Liquid crystal polymer film based flexible copper clad laminate
- --
- --
- 0.002
- 2.9
- 5G
- --
- --
- --
- --
- --
- SF202C
- High solder resistance polyimide film based coverlay
- --
- --
- 0.008
- 3.2
- Medical Instrument
- --
- --
- --
- --
- --
- SF206C
- Low Dk/Df polyimide film based coverlay
- --
- --
- 0.004
- 2.7
- 5G
- --
- --
- --
- --
- --
- SF305C
- Halogen-free flame-resistant type PI film based coverlay
- --
- --
- 0.017
- 3.3
- Power battery protection board CCM Module Battery Module Antenna Module FPM Module LCD Module Light-Bar Module TP Module Vehicle-mounted Module
- --
- --
- 4.50%
- 140
- 310
- SF315C
- Flame-resistant type black polyimide film based coverlay
- --
- --
- 0.017
- 3.5
- WPC Light-Bar Module
- --
- --
- 4.50%
- 135
- 310
- SF325C
- Anti-ion Migration type PI film base coverlay
- --
- --
- 0.017
- 3.4
- COF Module
- --
- --
- --
- --
- --
- SF206B
- LowDk/Df Bonding film
- --
- --
- 0.003
- 2.5
- 5G
- --
- --
- --
- --
- --
- SF315B
- Halogen-free type epoxy bonding film
- --
- --
- 0.02
- 3.4
- Multilayer Module Rigid-Flex Module
- --
- --
- --
- --
- --