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Select product series
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Smart Terminal
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
IC Substrate Materials
IMS and HTC materials
Special Materials
HSD Materials
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
Input specification value filtering
Product List
- product name
- Product brief description
- CTI
- Thermal conductivity（W/m·K）
- Df/10GHz
- Dk/10GHz
- application area
- Dk
- Df
- CTE
- Tg
- Td
- SCGA-500 GF265
- PTFE with Glass Reinforced RF Circuit Material
- --
- --
- --
- --
- 2.65
- 0.0017
- --
- --
- --
- SCGA-500 GF300
- PTFE with Glass Reinforced RF Circuit Material
- --
- --
- --
- --
- 3.00
- 0.0023
- --
- --
- --
- LNB33
- Glass Reinforced Hydrocarbon Ceramic High Frequency Circuit Material
- --
- --
- --
- --
- 3.30
- 0.0025
- --
- --
- --
- S7136H
- Glass Reinforced Hydrocarbon Ceramic High Frequency Circuit Material
- --
- --
- --
- --
- 3.42
- 0.0030
- --
- --
- --
- AeroWave 300
- Glass Reinforced Thermosetting High Frequency Circuit Material
- --
- --
- --
- --
- 3.0
- 0.0031
- --
- --
- --